Monsieur Mohamed BOUCHOUCHA / PhD

Contact details

Professional experience

Field of activity : Photovoltaïque

Contract type : Entreprises

Function : Ingénieur recherche et développement

Organization or company : Wysips

Website : http://fr.wysips.com/

Company size : 50-99

City : Aix en Provence

Country : FRANCE

Jobs

Research : NON

Techniques

material science / microelectronic and packaging process / 3D integration and Wafer Level Packaging / microelectronic reliability / finite element modeling (Ansys)

PhD

Title : PHYSIQUE & SCIENCES DE LA MATIERE - Spécialité : MATIERE CONDENSEE et NANOSCIENCES

First registration date : 1 December 2009 / 4A

Doctoral school : Physique et Sciences de la Matière

Thesis defense date : 22 January 2013

Subject : Remplissage en polymère des via transversant (TSV) pour les applications 3D-Wafer Level Packaging

Thesis supervisor : THOMAS Olivier

Thesis co-supervisor : BOZZO-ESCOUBAS Stéphanie

Research unit : CEA Grenoble

Team : LETI

Master's degree

Title : Sciences et Génie des Matériaux

September 2009 - Grenoble INP

Mention : Bien

Publications

  • Process solutions and polymer materials for 3D-WLP through silicon via filling
    IEEE - ECTC 2010, 2010
    Bouchoucha, M. Chausse, P. ; Henry, D. ; Sillon, N.
    http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5490748&tag=1
  • Through silicon via polymer filling for 3D – WLP applications
    IEEE - ESTC 2010, 2010
    Bouchoucha, M. Chapelon, L.-L. ; Chausse, P. ; Moreau, S. ; Sillon, N.
    http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5642998
  • Reliability Study of 3D-WLP Through Silicon Via with Innovative Polymer Filling Integration
    IEEE - ECTC 2011, 2011
    Bouchoucha, M. Chausse, P. ; Moreau, S. ; Chapelon, L.-L. ; Sillon, N. ; Thomas, O.
    http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5898568
  • Polymer filling of medium density through silicon via for 3D-packaging
    IEEE - EPTC 2009, 2009
    Chausse, P. Bouchoucha, M. ; Henry, D. ; Sillon, N. ; Chapelon, L.L.
    http://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=5416443&contentType=Conference+Publications&searchWithin%3Dp_Authors%3A.QT.Bouchoucha%2C+M..QT.%26searchField%3DSearch_All

Languages

Anglais : C2 - Courant